Design and Fabrication of Large Scale Micro-LED Arrays and Silicon Driver for OEIC Devices

Sang-Baie SHIN  Ko-Ichiro IIJIMA  Hiroshi OKADA  Sho IWAYAMA  Akihiro WAKAHARA  

IEICE TRANSACTIONS on Electronics   Vol.E95-C   No.5   pp.898-903
Publication Date: 2012/05/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E95.C.898
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on Fundamentals and Applications of Advanced Semiconductor Devices)
opto-electronic integrated circuit,  micro-LED,  flip-chip bonding,  GaN LED arrays,  

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In this paper, we designed and fabricated large scale micro-light-emitting-diode (LED) arrays and silicon driver for single chip device for realizing as prototypes of heterogeneous optoelectronic integrated circuits (OEICs). The large scale micro-LED arrays were separated by a dry etching method from mesa structure to 16,384 pixels of 128 128, each with a size of 15 µm in radius. Silicon driver was designed the additional bonding pad on each driving transistor for bonding with micro-LED arrays. Fabricated micro-LED arrays and driver were flip-chip bonded using anisotropic conductive adhesive.