Integration of Silicon Nano-Photonic Devices for Telecommunications

Seiichi ITABASHI  Hidetaka NISHI  Tai TSUCHIZAWA  Toshifumi WATANABE  Hiroyuki SHINOJIMA  Rai KOU  Koji YAMADA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E95-C   No.2   pp.199-205
Publication Date: 2012/02/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E95.C.199
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Section on Photonic Devices using Nanofabrication Technology and Their Applications)
Category: 
Keyword: 
siliconphotonics,  integration,  nanofabrication,  telecommunication,  

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Summary: 
Monolithic integration of various kinds of optical components on a silicon wafer is the key to making silicon (Si) photonics practical technology. Applying silicon photonics to telecommunications further requires low insertion loss and polarization independence. We propose an integration concept for telecommunications based on Si and related materials and demonstrate monolithic integration of passive and dynamic functional components. This article shows the great potential of Si photonics technology for telecommunications.