Integration of Silicon Nano-Photonic Devices for Telecommunications

Seiichi ITABASHI
Hidetaka NISHI
Tai TSUCHIZAWA
Toshifumi WATANABE
Hiroyuki SHINOJIMA
Rai KOU
Koji YAMADA

Publication
IEICE TRANSACTIONS on Electronics   Vol.E95-C    No.2    pp.199-205
Publication Date: 2012/02/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E95.C.199
Print ISSN: 0916-8516
Type of Manuscript: Special Section INVITED PAPER (Special Section on Photonic Devices using Nanofabrication Technology and Their Applications)
Category: 
Keyword: 
siliconphotonics,  integration,  nanofabrication,  telecommunication,  

Full Text: FreePDF

Summary: 
Monolithic integration of various kinds of optical components on a silicon wafer is the key to making silicon (Si) photonics practical technology. Applying silicon photonics to telecommunications further requires low insertion loss and polarization independence. We propose an integration concept for telecommunications based on Si and related materials and demonstrate monolithic integration of passive and dynamic functional components. This article shows the great potential of Si photonics technology for telecommunications.