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Measurement of Integrated PA-to-LNA Isolation on Si CMOS Chip
Ryo MINAMI JeeYoung HONG Kenichi OKADA Akira MATSUZAWA
IEICE TRANSACTIONS on Electronics
Publication Date: 2011/06/01
Online ISSN: 1745-1353
Print ISSN: 0916-8516
Type of Manuscript: BRIEF PAPER
CMOS, power amplifier, substrate coupling, Tx leakage, mutual coupling,
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This paper presents measurement of on-chip coupling between PA and LNA integrated on Si CMOS substrate, which is caused by substrate coupling, magnetic coupling, power-line coupling, etc. These components are decomposed by measurements using diced chips. The result reveals that the substrate coupling is the most dominant in CMOS chips and the total isolation becomes less than -50 dB with more than 0.4 mm PA-to-LNA distance.