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Impact of Self-Heating in Wire Interconnection on Timing
Toshiki KANAMOTO Takaaki OKUMURA Katsuhiro FURUKAWA Hiroshi TAKAFUJI Atsushi KUROKAWA Koutaro HACHIYA Tsuyoshi SAKATA Masakazu TANAKA Hidenari NAKASHIMA Hiroo MASUDA Takashi SATO Masanori HASHIMOTO
IEICE TRANSACTIONS on Electronics
Publication Date: 2010/03/01
Online ISSN: 1745-1353
Print ISSN: 0916-8516
Type of Manuscript: BRIEF PAPER
interconnect, delay variation, parasitic resistance, thermal, temperature, self-heat, SoC,
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This paper evaluates impact of self-heating in wire interconnection on signal propagation delay in an upcoming 32 nm process technology, using practical physical parameters. This paper examines a 64-bit data transmission model as one of the most heating cases. Experimental results show that the maximum wire temperature increase due to the self-heating appears in the case where the ratio of interconnect delay becomes largest compared to the driver delay. However, even in the most significant case which induces the maximum temperature rise of 11.0, the corresponding increase in the wire resistance is 1.99% and the resulting delay increase is only 1.15%, as for the assumed 32 nm process. A part of the impact reduction of wire self-heating on timing comes from the size-effect of nano-scale wires.