Routability Driven Via Assignment Method for 2-Layer Ball Grid Array Packages


IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences   Vol.E92-A   No.6   pp.1433-1441
Publication Date: 2009/06/01
Online ISSN: 1745-1337
DOI: 10.1587/transfun.E92.A.1433
Print ISSN: 0916-8508
Type of Manuscript: PAPER
Category: VLSI Design Technology and CAD
ball grid array,  monotonic,  package routing,  via assignment,  

Full Text: PDF>>
Buy this Article

Ball Grid Array packages in which I/O pins are arranged in a grid array pattern realize a number of connections between chips and a printed circuit board, but it takes much time in manual routing. We propose a fast routing method for 2-layer Ball Grid Array packages that iteratively modifies via assignment. In experiments, in most cases, via assignment and global routing on both of layers in which all nets are realized and the violation of wire congestion on layer 1 is small are speedily obtained.