Measurement-Based Analysis of Electromagnetic Immunity in LSI Circuit Operation

Kouji ICHIKAWA  Yuki TAKAHASHI  Yukihiko SAKURAI  Takahiro TSUDA  Isao IWASE  Makoto NAGATA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E91-C   No.6   pp.936-944
Publication Date: 2008/06/01
Online ISSN: 1745-1353
DOI: 10.1093/ietele/e91-c.6.936
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on Analog Circuits and Related SoC Integration Technologies)
Category: 
Keyword: 
integrated circuit,  electro magnetic interference,  on-chip monitor,  immunity,  

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Summary: 
Impacts of electromagnetic (EM) interference (immunity) on operation of LSI circuits in a QFP-packaged and PCB-mounted environment are studied. EM power injection to a power-supply system leads to malfunction, where the power is translated into voltage bounces through combined on- and off- chip impedances, affecting power supply and ground, as well as signal nodes in a die, seen from on-chip waveform measurements. A lumped power-supply impedance model and the minimum amplitude of voltage bounce induced by EM power for malfunction, both of which can be derived from external measurements to a given packaged LSI, formulate an EM interference model that is helpful in the PCB design toward high immunity. The technique can be generally applied to systems-on-chip applications.