Compact and High-Power Spatial Power Combiner by Active Integrated Antenna Technique at 5.8 GHz

Harunobu SEITA  Shigeo KAWASAKI  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E91-C   No.11   pp.1757-1764
Publication Date: 2008/11/01
Online ISSN: 1745-1353
DOI: 10.1093/ietele/e91-c.11.1757
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on Microwave and Millimeter-wave Technologies)
Category: 
Keyword: 
active integrated antenna,  Angelov model,  heat sink mechanism,  high power amplifier circuit,  wireless power transmission,  

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Summary: 
Compact and planar active integrated antenna arrays with a high power multi-stage amplifier were developed with effective heat sink mechanism. By attaching an aluminum plate to the backside of the creased amplifier circuit board, effective cooling can be achieved. The nonlinear behavior of the amplifier agrees well with the simulation based on the Angelov model. The high power amplifier circuit consisted of the three-stage amplifier and operated with an output power of 4 W per each element at 5.8 GHz. The 32-element active integrated antenna array stably operated with the output power of 120 W under the effective heat sink design. With a weight of 4 kg, the weight-to-output power ratio and the volume-to-output power ratio of the antenna array are 33.3 g/W and 54.5 cm3/W, respectively. Wireless power transmission was also successfully demonstrated.