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Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology
Hiroyuki ITO Hideyuki SUGITA Kenichi OKADA Tatsuya ITO Kazuhisa ITOI Masakazu SATO Ryozo YAMAUCHI Kazuya MASU
IEICE TRANSACTIONS on Electronics
Publication Date: 2007/03/01
Online ISSN: 1745-1353
Print ISSN: 0916-8516
Type of Manuscript: LETTER
Category: Microwaves, Millimeter-Waves
wafer-level chip scale package, RF CMOS, passive device,
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This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90directional coupler using the WL-CSP technology has center frequency of 25.6 GHz, insertion loss of -0.5 dB and isolation of -29.8 dB in the measurement result. The WL-CSP technology contributes to realize low-loss RF passive devices on Si CMOS chip, which is indispensable to achieve small-size, cost-effective and low-power monolithic wireless communication circuits (MWCCs).