Low-Loss Distributed Constant Passive Devices Using Wafer-Level Chip Scale Package Technology

Hiroyuki ITO  Hideyuki SUGITA  Kenichi OKADA  Tatsuya ITO  Kazuhisa ITOI  Masakazu SATO  Ryozo YAMAUCHI  Kazuya MASU  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E90-C   No.3   pp.641-643
Publication Date: 2007/03/01
Online ISSN: 1745-1353
DOI: 10.1093/ietele/e90-c.3.641
Print ISSN: 0916-8516
Type of Manuscript: LETTER
Category: Microwaves, Millimeter-Waves
Keyword: 
wafer-level chip scale package,  RF CMOS,  passive device,  

Full Text: PDF>>
Buy this Article




Summary: 
This paper proposes high-Q distributed constant passive devices using wafer-level chip scale package (WL-CSP) technology, which can be realized on a Si CMOS chip. A 90directional coupler using the WL-CSP technology has center frequency of 25.6 GHz, insertion loss of -0.5 dB and isolation of -29.8 dB in the measurement result. The WL-CSP technology contributes to realize low-loss RF passive devices on Si CMOS chip, which is indispensable to achieve small-size, cost-effective and low-power monolithic wireless communication circuits (MWCCs).