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A Statistical Quality Model for Delay Testing
Yasuo SATO Shuji HAMADA Toshiyuki MAEDA Atsuo TAKATORI Seiji KAJIHARA
Publication
IEICE TRANSACTIONS on Electronics
Vol.E89-C
No.3
pp.349-355 Publication Date: 2006/03/01 Online ISSN: 1745-1353
DOI: 10.1093/ietele/e89-c.3.349 Print ISSN: 0916-8516 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design Technology in the Sub-100 nm Era) Category: Signal Integrity and Variability Keyword: delay testing, quality model, defect distribution,
Full Text: PDF(933.9KB)>>
Summary:
In this paper we introduce a statistical quality model for delay testing that reflects fabrication process quality, design delay margin, and test timing accuracy. The model provides a measure that predicts the chip defect level that cause delay failure, including marginal small delay. We can therefore use the model to make test vectors that are effective in terms of both testing cost and chip quality. The results of experiments using ISCAS89 benchmark data and some large industrial design data reflect various characteristics of our statistical delay quality model.
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