Near-Field Magnetic Measurements and Their Application to EMC of Digital Equipment

Takashi HARADA  Norio MASUDA  Masahiro YAMAGUCHI  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E89-C   No.1   pp.9-15
Publication Date: 2006/01/01
Online ISSN: 1745-1353
DOI: 10.1093/ietele/e89-c.1.9
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Section on Near-Field and Far-Field Electromagnetic Absorption and Shielding and Related Technologies)
Category: 
Keyword: 
near field,  electromagnetic compatibility,  loop probe,  printed circuit board,  package,  

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Summary: 
Techniques of near-field magnetic measurement and their applications to EMC of digital equipment are described. Magnetic-field measurement near PCB or LSI is the mostly used technique to specify the source. This paper treats an example of board analysis by near-field magnetic measurement, the sensing mechanism and the structure of a loop probe, and a recent progress of this method and application. To establish appropriate design direction in high-speed and high-density packaging of electronic equipment, electromagnetic behavior in chip and package should be clarified. Expectation of development for measuring minute area is more and more increasing.