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A Reliability-Enhanced TCAM Architecture with Associated Embedded DRAM and ECC
Hideyuki NODA Katsumi DOSAKA Hans Jurgen MATTAUSCH Tetsushi KOIDE Fukashi MORISHITA Kazutami ARIMOTO
IEICE TRANSACTIONS on Electronics
Publication Date: 2006/11/01
Online ISSN: 1745-1353
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on Novel Device Architectures and System Integration Technologies)
soft error, ECC, TCAM, embedded, DRAM,
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This paper describes a novel TCAM architecture designed for enhancing the soft-error immunity. An associated embedded DRAM and ECC circuits are placed next to TCAM macro to implement a unique methodology of recovering upset bits due to soft errors. The proposed configuration allows an improvement of soft-error immunity by 6 orders of magnitude compared with the conventional TCAM. We also propose a novel testing methodology of the soft-error rate with a fast parallel multi-bit test. In addition, the proposed architecture resolves the critical problem of the look-up table maintenance of TCAM. The design techniques reported in this paper are especially attractive for realizing soft-error immune, high-performance TCAM chips.