A Low Loss Multi-Layer Dielectric Waveguide Filter for 60-GHz System-on-Package Applications

Dong Yun JUNG  Won Il CHANG  Ji Hoon KIM  Chul Soon PARK  

Publication
IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences   Vol.E89-A   No.6   pp.1690-1691
Publication Date: 2006/06/01
Online ISSN: 1745-1337
DOI: 10.1093/ietfec/e89-a.6.1690
Print ISSN: 0916-8508
Type of Manuscript: Special Section LETTER (Special Section on Papers Selected from 2005 International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC2005))
Category: 
Keyword: 
low temperature co-fired ceramic (LTCC),  dielectric waveguide filter,  system-on-package (SoP),  

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Summary: 
For V-band applications, this paper presents a fully embedded multi-layer dielectric waveguide filter (DWGF) with very low insertion loss and small size, which does not need any more assemblies such as flip-chip bonding and bond wires. The top and bottom plane are grounded, and therefore, although we make a metal housing, there will be no resonance occurrences. Especially, the proposed structure is very suitable for MMICs interconnection because the in/output pads consist of conductor backed co-planar waveguide (CBCPW). The filter is formed incorporating metallized through holes in low temperature co-fired ceramic (LTCC) substrates with relative dielectric constant of 7.05. The total volume of the filter including transitions is 4.5 mm2.65 mm0.4 mm. A fabricated DWGF with four transitions shows an insertion loss and a return loss of 2.95 dB and less than 15 dB at the center frequency of 62.17 GHz, respectively. According to the authors' knowledge, the proposed filter shows the lowest insertion loss among the embedded multi-layer millimeter-wave filters ever reported for 60 GHz applications.