Thermal-Aware Placement Based on FM Partition Scheme and Force-Directed Heuristic

Jing LI  Hiroshi MIYASHITA  

IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences   Vol.E89-A   No.4   pp.989-995
Publication Date: 2006/04/01
Online ISSN: 1745-1337
DOI: 10.1093/ietfec/e89-a.4.989
Print ISSN: 0916-8508
Type of Manuscript: Special Section PAPER (Special Section on Selected Papers from the 18th Workshop on Circuits and Systems in Karuizawa)
VLSI circuit physical design,  thermal placement,  partitioning,  reliability,  force-directed algorithm,  

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Temperature-tracking is becoming of paramount importance in modern electronic design automation tools. In this paper, we present a deterministic thermal placement algorithm for standard cell based layout which can lead to a smooth temperature distribution over the die. It is mainly based on Fiduccia-Mattheyses partition scheme and a former substrate thermal model that can convert the known temperature constraints into the corresponding power distribution constraints. Moreover, a kind of force-directed heuristic based on cells' power consumption is introduced in the above process. Experimental results demonstrate a comparatively uniform temperature distribution and show a reduction of the maximal temperature on the die.