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Formula-Based Method for Capacitance Extraction of Interconnects with Dummy Fills
Atsushi KUROKAWA Akira KASEBE Toshiki KANAMOTO Yun YANG Zhangcai HUANG Yasuaki INOUE Hiroo MASUDA
IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2006/04/01
Online ISSN: 1745-1337
Print ISSN: 0916-8508
Type of Manuscript: Special Section PAPER (Special Section on Selected Papers from the 18th Workshop on Circuits and Systems in Karuizawa)
dummy fill, capacitance extraction, capacitance formula, interconnect,
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In advanced ASIC/SoC physical designs, interconnect parasitic extraction is one of the important factors to determine the accuracy of timing analysis. We present a formula-based method to efficiently extract interconnect capacitances of interconnects with dummy fills for VLSI designs. The whole flow is as follows: 1) in each process, obtain capacitances per unit length using a 3-D field solver and then create formulas, and 2) in the actual design phase, execute a well-known 2.5-D capacitance extraction. Our results indicated that accuracies of the proposed formulas were almost within 3% error. The proposed formula-based method can extract interconnect capacitances with high accuracy for VLSI circuits. Moreover, we present formulas to evaluate the effect of dummy fills on interconnect capacitances. These can be useful for determining design guidelines, such as metal density before the actual design, and for analyzing the effect of each structural parameter during the design phase.