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Novel Stacked Packaging Structure Using Silica-Based PLC with Integrated Micro-Mirrors and Its Application to 8ch PD Array Module
Ikuo OGAWA Makoto ABE Yoshiyuki DOI Senichi SUZUKI
IEICE TRANSACTIONS on Electronics
Publication Date: 2005/08/01
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices--Selected Papers from International Session on Electro-Mechanical Devices 2004 (IS-EMD2004)--)
Category: Optical Interconnection
silica-based PLC, micro-mirror, stacked packaging, hybrid integration,
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We propose and demonstrate a new stacked packaging structure using silica-based planar lightwave circuits (PLCs) with integrated micro-mirrors. This structure enables us to integrate active devices on PLCs with certain flexibility as regards optical coupling design and device selection. To achieve this, we developed an integrated micro-mirror with an accurate reflection angle and shielding structures to prevent crosstalk, and successfully demonstrated an 8-channel photodiode array module with excellent characteristics consisting of a high responsivity of > 0.85 A/W and a low crosstalk of < -65 dB.