Novel Stacked Packaging Structure Using Silica-Based PLC with Integrated Micro-Mirrors and Its Application to 8ch PD Array Module

Ikuo OGAWA  Makoto ABE  Yoshiyuki DOI  Senichi SUZUKI  

IEICE TRANSACTIONS on Electronics   Vol.E88-C   No.8   pp.1552-1558
Publication Date: 2005/08/01
Online ISSN: 
DOI: 10.1093/ietele/e88-c.8.1552
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices--Selected Papers from International Session on Electro-Mechanical Devices 2004 (IS-EMD2004)--)
Category: Optical Interconnection
silica-based PLC,  micro-mirror,  stacked packaging,  hybrid integration,  

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We propose and demonstrate a new stacked packaging structure using silica-based planar lightwave circuits (PLCs) with integrated micro-mirrors. This structure enables us to integrate active devices on PLCs with certain flexibility as regards optical coupling design and device selection. To achieve this, we developed an integrated micro-mirror with an accurate reflection angle and shielding structures to prevent crosstalk, and successfully demonstrated an 8-channel photodiode array module with excellent characteristics consisting of a high responsivity of > 0.85 A/W and a low crosstalk of < -65 dB.