A Cascade Open-Short-Thru (COST) De-Embedding Method for Microwave On-Wafer Characterization and Automatic Measurement

Ming-Hsiang CHO  Guo-Wei HUANG  Chia-Sung CHIU  Kun-Ming CHEN  An-Sam PENG  Yu-Min TENG  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E88-C   No.5   pp.845-850
Publication Date: 2005/05/01
Online ISSN: 
DOI: 10.1093/ietele/e88-c.5.845
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on Microelectronic Test Structures)
Category: 
Keyword: 
automatic measurement,  cascade configuration,  on-wafer de-embedding,  silicon,  S-parameters,  

Full Text: PDF>>
Buy this Article




Summary: 
In this study, a cascade open-short-thru (COST) de-embedding procedure is proposed for the first time for on-wafer device characterization in the RF/microwave frequency regime. This technique utilizes the "open" and "short" dummy structures to de-embed the probe-pad parasitics of a device-under-test (DUT). Furthermore, to accurately estimate the input/output interconnect parasitics, including the resistive, inductive, capacitive, and conductive components, the "thru" dummy device has been characterized after probe-pad de-embedding. With the combination of transmission-line theory and cascade-configuration concept, this method can efficiently generate the scalable and repeatable interconnect parameters to completely eliminate the redundant parasitics of the active/passive DUTs of various device sizes and interconnect dimensions. Consequently, this method is very suitable for the on-wafer automatic measurement.