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77-GHz MMIC Module Design Techniques for Automotive Radar Applications
Yasushi ITOH Kazuhiko HONJO
IEICE TRANSACTIONS on Electronics
Publication Date: 2005/10/01
Print ISSN: 0916-8516
Type of Manuscript: REVIEW PAPER
millimeter-wave, MMIC, module, automotive radar sensor, MCM, SiP, SoC, flip-chip,
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Recent advances in 77-GHz MMIC module design techniques for automotive radar applications are reviewed in this paper. The target of R&D activities is moving from high performance to low cost, mass production, high-yield manufacturing and testing. To meet the stringent requirements, millimeter-wave module design techniques have made significant progress especially in packaging, bonding, and making interface with other modules. In addition, millimeter-wave semiconductor devices and MMICs have made remarkable improvements for low cost and mass production. In this paper, the topics focusing on millimeter-wave semiconductor devices and 77-GHz MMICs are reviewed first. Then the recent R&D results on 77-GHz MMIC module design techniques are introduced, showing the technical trend of packaging, bonding, and making interface with other modules for millimeter-wave, highly-integrated, low-cost MMIC modules. Finally, the existing and future module design issues for automotive radar applications are discussed.