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Modeling and Simulation of Via-Connected Power Bus Stacks in Multilayer PCBs
Zhi Liang WANG Osami WADA Takashi HARADA Takahiro YAGUCHI Yoshitaka TOYOTA Ryuji KOGA
IEICE TRANSACTIONS on Communications
Publication Date: 2005/08/01
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section of 2004 International Symposium on Electromagnetic Compatibility)
Category: Printed Circuit Boards
power bus stack and modeling, cavity-mode model, via interconnect, EMI,
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Power bus noise problem has become a major concern for both EMC engineers and board designers. A fast algorithm, based on the cavity-mode model, was employed for analyzing resonance characteristics of multilayer power bus stacks interconnected by vias. The via is modeled as an inductance and its value is given by a simple expression. Good agreement between the simulated results and measurements demonstrates the effectiveness of the cavity-mode model, together with the via model.