Effects of On-Chip Inductance on Power Distribution Grid

Hidetoshi ONODERA

IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences   Vol.E88-A    No.12    pp.3564-3572
Publication Date: 2005/12/01
Online ISSN: 
DOI: 10.1093/ietfec/e88-a.12.3564
Print ISSN: 0916-8508
Type of Manuscript: Special Section LETTER (Special Section on VLSI Design and CAD Algorithms)
power distribution network,  on-chip inductance,  power supply noise,  decoupling capacitance,  

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With increase of clock frequency, on-chip wire inductance starts to play an important role in power/ground distribution analysis, although it has not been considered so far. We perform a case study work that evaluates relation between decoupling capacitance position and noise suppression effect, and we reveal that placing decoupling capacitance close to current load is necessary for noise reduction. We experimentally show that impact of on-chip inductance becomes small when on-chip decoupling capacitance is well placed according to local power consumption. We also examine influences of grid pitch, wire area, and spacing between paired power and ground wires on power supply noise. When effect of on-chip inductance on power/ground noise is significant, minification of grid pitch is more efficient than increase in wire area, and small spacing reduces power noise as we expected.

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