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Practical Design and Modeling Procedure of Test Structures for Microwave Bare-Chip Devices
IEICE TRANSACTIONS on Electronics
Publication Date: 2004/01/01
Print ISSN: 0916-8516
Type of Manuscript: PAPER
Category: Microwaves, Millimeter-Waves
RF, de-embed, bare-chip, simulation, SPICE, characterizations,
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This paper presents practical modeling procedure of feed patterns, bond wires, and interconnects for microwave bare-chip devices. Dedicated test structures have been designed for the process. Modeling accuracy of BJTs and diodes has been unprecedentedly improved up to 30 GHz with this procedure despite popular SPICE models were used.