Hierarchical Multi-Chip Architecture for High Capacity Scalability of Fully Parallel Hamming-Distance Associative Memories

Yusuke OIKE  Makoto IKEDA  Kunihiro ASADA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E87-C   No.11   pp.1847-1855
Publication Date: 2004/11/01
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on New System Paradigms for Integrated Electronics)
Category: 
Keyword: 
associative memory,  content addressable memory,  CAM,  Hamming distance,  capacity scalability,  multi-chip structure,  

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Summary: 
In this paper, we present a hierarchical multi-chip architecture which employs fully digital and word-parallel associative memories based on Hamming distance. High capacity scalability is critically important for associative memories since the required database capacity depends on the various applications. A multi-chip structure is most efficient for the capacity scalability as well as the standard memories, however, it is difficult for the conventional nearest-match associative memories. The present digital implementation is capable of detecting all the template data in order of the exact Hamming distance. Therefore, a hierarchical multi-chip structure is simply realized by using extra register buffers and an inter-chip pipelined priority decision circuit hierarchically embedded in multiple chips. It achieves fully chip- and word-parallel Hamming distance search with no throughput decrease, additional clock latency of O(log P), and inter-chip wires of O(P) in a P-chip structure. The feasibility of the architecture and circuit implementation has been demonstrated by post-layout simulations. The performance has been also estimated based on measurement results of a single-chip implementation.