Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA

Stephane PINEL  Mekita F. DAVIS  Venky SUNDARAM  Kyutae LIM  Joy LASKAR  George WHITE  Rao R. TUMMALA  

IEICE TRANSACTIONS on Electronics   Vol.E86-C   No.8   pp.1584-1592
Publication Date: 2003/08/01
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter Wave Technology)
LCP,  µBGA,  inductors,  microwave module,  

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Electronics packaging evolution involves both systems, technology & materials considerations. In this paper, we present a novel 3D integration approach for system-on-package (SOP) based solutions for wireless communication applications. This concept is proposed for the 3D integration of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LCP (Liquid Crystal Polymer) substrates using µBGA technology. LCP substrates fabrication, high Q inductor design and the associated physical based modeling are detailed. Then stacking techniques using µBGA technology is presented. Characterization and modeling of RF vertical board-to-board transition, using µBGA process are detailed and show that this vertical transition is suitable for C-band wireless communication applications.