Opto-Electronic Integrated Information System

Jun TANIDA  Keiichiro KAGAWA  Kenji YAMADA  

IEICE TRANSACTIONS on Electronics   Vol.E84-C   No.12   pp.1778-1784
Publication Date: 2001/12/01
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Integrated Systems with New Concepts)
optical interconnection,  optical processing,  smart pixel,  optoelectronics,  information system,  

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As a new category of the optical application system integrated with electronics, the opto-electronic information system (OEIS) is presented. Combination of the different characteristic technologies, optics and electronics, is expected to be useful for development of an effective and high-performance information systems. The properties of the optical technologies such as parallelism, high-speed, and large information capacity can be utilized for information processing. Even if some of the functions are emulated by the electronics, the optics give more effective solutions. To implement the OEIS, various optoelectronic devices and fabrication technologies are available including vertical cavity surface emitting lasers and spatial light modulators. There are two forms of system construction for the OEIS: an application of optics to an electronic-based system and the reversed form. As examples of the OEIS, the parallel matching architecture (PMA) and the thin observation module by bound optics (TOMBO) are presented. The PMA is an architecture of parallel computing system specified for global processing. This architecture shows a typical strategy to utilize the optical interconnection capability with flexibility of the electronic technology. The TOMBO presents possibility of morphological conversion using combination of the optical and electronic technologies. A compound-eye imaging system and post digital processing enable us to realize a very thin image capturing system. The issues related on development of the OEIS are proper usage of optics, effective fusion of the optical and electronic technologies, methodologies for system construction, fabrication supporting tools, and development of attractive demonstrators other than communication and interconnection fields.