Packaging Technology Trends and Challenges for System-in-Package

Akihiro DOHYA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E84-C   No.12   pp.1756-1762
Publication Date: 2001/12/01
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
packaging technology,  system-in-package,  SIP,  SoC,  CSP,  

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Summary: 
The packaging hierarchy is not fixed structure. It can be changed depending on the packaging technology itself, and the number of hierarchy levels tends to decrease. In LSI-package technology including package-to-board interconnections, there were two evolutionary changes. The first evolution was from PTH to SMT, and the second evolution was from "Peripheral connections" to "Area-array connections. " These evolutions have been caused by ICs integration and application products requirements. Now, the third evolution appears to be in progress, which is from SCP to MCP or SIP. Although SoC has many remarkable features, it has been not applied for many systems contrary to expectations, and its limitations or issues have become clear. SIP is the answer for above SoC's issues. MCP can be considered to be primitive SIP. The purpose of MCP is making up the technology gap between SMT and SoC to address the issues. The targets of SIP are mainly the next two items. (1) Overcoming the interconnection crisis of SoC. (2) Opening new application fields in electronics. In order to achieve those targets, several consortiums in the world are doing research and developing core technologies.