Superconnect Technology

Takayasu SAKURAI  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E84-C   No.12   pp.1709-1716
Publication Date: 2001/12/01
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
system-on-a-chip,  system-in-a-package,  superconnect,  RC delay,  interconnect,  

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Summary: 
Future electronic systems can not be built only with System-on-a-Chip (SoC), since many SoC issues have become evident. Relatively low yield due to the larger die size and the huge investment in developing the process to embed different kinds of technologies are some of the issues. Instead, superconnect technology is getting more important as a viable solution in building electronic systems. The superconnect connects separately built and tested chips not by the printed circuit board but rather directly to construct high-performance yet low-cost electronic systems and may use around 10 micron level design rules. System-in-a-Package and stacked chips using interposers are some realization of the superconnect. The superconnect will also be used to mitigate IR-drop problems and RC delay problems in global on-chip interconnect.