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Advanced SOI MOSFET's with Strained-Si/SiGe Heterostructures
Tomohisa MIZUNO Naoharu SUGIYAMA Atsushi KUROBE Shin-ichi TAKAGI
IEICE TRANSACTIONS on Electronics
Publication Date: 2001/10/01
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Joint Special Issue on Heterostructure Microelectronics with TWHM 2000 (Topical Workshop on Heterostructure Microelectronics 2000))
Category: SiGe HBTs & FETs
strained-Si, SOI, SiGe, SIMOX, mobility,
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We have developed advanced SOI n- and p-MOSFETs with strained-Si channel on insulator (strained-SOI) structure fabricated by SIMOX (separation-by-implanted-oxygen) technology. The characteristics of this strained-SOI substrate and electrical properties of strained-SOI MOSFET's have been experimentally studied. Using strained-Si/relaxed-SiGe epitaxy technology and usual SIMOX process, we have successfully formed the layered structure of fully-strained-Si (20 nm)/fully-relaxed-SiGe film (290 nm) on uniform buried oxide layer (85 nm) inside SiGe layer. Good drain current characteristics have been obtained in strained-SOI MOSFET's. It is found that both electron and hole mobility is enhanced in strained-SOI MOSFET's, compared to the universal mobility in an inversion layer and the mobility of control SOI MOSFET's. These mobility enhancement factors are almost the same as the theoretical results.