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Micromechanical Photonic Integrated Circuits
Ming C. WU
IEICE TRANSACTIONS on Electronics
Publication Date: 2000/06/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section INVITED PAPER (Special Issue on Advanced Optical Devices for Next Generation High-Speed Communication Systems and Photonic Networks)
Category: Switches and Novel Devices
MEMS, optical MEMS, MOEMS, photonic integrated circuits, micro-optics, optical interconnect,
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We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.