Non-uniform Multi-Layer IC Interconnect Transmission Line Characterization for Fast Signal Transient Simulation of High-Speed/High-Density VLSI Circuits

Woojin JIN  Hanjong YOO  Yungseon EO  

IEICE TRANSACTIONS on Electronics   Vol.E82-C   No.6   pp.955-966
Publication Date: 1999/06/25
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on TCAD for Semiconductor Industries)
interconnect,  substrate effect,  shielding effect,  signal integrity,  signal delay,  crosstalk noise,  

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A new IC interconnect transmission line parameter determination methodology and a novel fast simulation technique for non-uniform transmission lines are presented and verified. The capacitance parameter is a strong function of a shielding effect between the layers, while silicon substrate has a substantial effect on inductance parameter. Thus, they are taken into account to determine the parameters. Then the virtual straight-line-based per unit length parameters are determined in order to perform the fast transient simulation of the non-uniform transmission lines. It was shown that not only the inductance effect due to a silicon substrate but also the shielding effect between the layers are too significant to be neglected. Further, a model order reduction technique is integrated into Berkeley SPICE in order to demonstrate that the virtual straight-line-based per-unit-length parameters can be efficiently employed for the fast transient response simulation of the complicated multi-layer interconnect structures. Since the methodology is very efficient as well as accurate, it can be usefully employed for IC CAD tools of high-performance VLSI circuit design.