Characterisation of Offset Lithographic Films Using Microelectronic Test Structures

Anthony J. WALTON  J. Tom M. STEVENSON  Leslie I. HAWORTH  Martin FALLON  Peter S. A. EVANS  Blue J. RAMSEY  David HARRISON  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E82-C   No.4   pp.576-581
Publication Date: 1999/04/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Microelectronic Test Structures)
Category: 
Keyword: 
microelectronics,  test structure,  offset lithography,  linewidth,  

Full Text: PDF(780.7KB)>>
Buy this Article




Summary: 
This paper reports on the use of microelectronic test structures to characterise a novel fabrication technique for thin-film electronic circuit boards. In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Sheet resistance and linewidth for both horizontal and vertical lines are electrically evaluated and these compared with optical and surface profiling measurements.