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Characterisation of Offset Lithographic Films Using Microelectronic Test Structures
Anthony J. WALTON J. Tom M. STEVENSON Leslie I. HAWORTH Martin FALLON Peter S. A. EVANS Blue J. RAMSEY David HARRISON
IEICE TRANSACTIONS on Electronics
Publication Date: 1999/04/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Microelectronic Test Structures)
microelectronics, test structure, offset lithography, linewidth,
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This paper reports on the use of microelectronic test structures to characterise a novel fabrication technique for thin-film electronic circuit boards. In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Sheet resistance and linewidth for both horizontal and vertical lines are electrically evaluated and these compared with optical and surface profiling measurements.