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A Novel Resonant Coupling Type Microstrip Line Interconnect
Masashi HOTTA Yongxi QIAN Tatsuo ITOH
IEICE TRANSACTIONS on Electronics
Publication Date: 1999/01/25
Print ISSN: 0916-8516
Type of Manuscript: LETTER
Category: Microwave and Millimeter Wave Technology
resonant coupling, microstrip line, ribbon bonding, dielectric pad, FDTD,
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Resonant coupling type microstrip line interconnects using a bonding ribbon and dielectric pad have been designed and fabricated. The basic concept of this interconnect is the LC serial resonance of the pad capacitor and ribbon inductor. Both numerical simulation and experiment reveal low return loss and high efficiency connection at the predicted resonant frequency region, which can be readily shifted to higher frequencies by tuning the structural parameters. Improvement in bandwidth of the interconnect is demonstrated by using a pad with higher dielectric constant. Furthermore, it is also shown that a slight modification allows DC connection in addition to efficient coupling at the resonant frequency.