A Compact Plastic Package with High RF Isolation by Subsidiary Inner Ground Leads

Hidetoshi ISHIDA  Kazuo MIYATSUJI  Tsuyoshi TANAKA  Daisuke UEDA  Chihiro HAMAGUCHI  

IEICE TRANSACTIONS on Electronics   Vol.E82-C   No.11   pp.2044-2049
Publication Date: 1999/11/25
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
package,  subsidiary ground,  high isolation,  electromagnetic simulation,  

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A novel method to obtain a compact plastic package with higher isolation by providing subsidiary inner ground leads between outer leads is proposed and demonstrated. The effect of the subsidiary ground leads is investigated by using a 3-dimensional electromagnetic field simulation and measuring the fabricated packages. Newly designed package with subsidiary ground leads achieves higher isolation by more than 10 dB at 3 GHz as compared to a conventional package. This package is applied to GaAs SPDT switch IC's. Isolation of the switch IC's is improved by 5 dB at 3 GHz by the subsidiary inner ground leads. The isolation characteristics are discussed based on the equivalent circuit extracted from the simulation results.