Innovative Packaging and Fabrication Concept for a 28 GHz Communication Front-End

Wolfgang MENZEL  Jurgen KASSNER  Uhland GOEBEL  

IEICE TRANSACTIONS on Electronics   Vol.E82-C    No.11    pp.2021-2028
Publication Date: 1999/11/25
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
packaging,  interconnect,  fabrication techniques,  plastic injection molding,  waveguide filters,  

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Millimeter-wave systems increasingly are entering into commercial systems, both for communication and sensors for traffic or industrial applications. In many cases, circuit technology of the involved front-ends includes monolithic and hybrid integrated circuits and even waveguide components like filters or antenna feeds. In addition to the standard technical and environmental requirements, these front-ends have to be fabricated in large quantities at very low cost. After a short review of the problems and some general interconnect and packaging techniques for mm-wave front-ends, achievements of a research program will be presented at the example of components for a 28 GHz communication front-end. Emphasis is put on a novel feed-through structure using multilayer carrier substrates for mm-wave circuits, some advances in electromagnetic field coupling for interconnects to mm-wave MMICs, and the realization of packages including waveguide components by plastic injection molding and electroplating. Results of filters and a diplexer produced in this way are shown, including pretuning of the filters to compensate the shrinking of the plastic parts during cooling.