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High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs
Hiroyuki SAKAI Takayuki YOSHIDA Morikazu SAGAWA
IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
flip-chip, bump, HIC (Hybrid IC), microwave, millimeter-wave,
Full Text: PDF(1.2MB)>>
This paper describes new IC design concepts using flip-chip bonding technologies for microwave and millimeter-wave circuit integration. Two types of bonding technologies, stud bump bonding (SBB) and micro bump bonding (MBB) are introduced, and their applications to microwave and millimeter-wave ICs are presented. Receiver front-end hybrid IC (HIC) for cellular and PHS handsets using SBB and new millimeter-wave ICs on Si substrate called millimeter flip-chip IC (MFIC) using MBB have been designed and fabricated to prove their advantages. These flip-chip bonding technologies are experimentally proven to provide excellent solutions for high performance and compact-sized ICs with low-cost. The HIC concept is applicable consistently over a wide range of devices from RF/microwave to millimeter-wave region.