Fabrication Processes for High-Tc Superconducting Integrated Circuits Based on Edge-Type Josephson Junctions

Tetsuro SATOH  Mutsuo HIDAKA  Shuichi TAHARA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E81-C   No.10   pp.1532-1537
Publication Date: 1998/10/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Issue on Low- and High-Temperature Superconductive Electron Devices and Their Applications)
Category: High-Tc Junction Technology
Keyword: 
YBa2Cu3Ox,  PrBa2Cu3Ox,  Josephson junction,  integrated circuit,  groundplane,  

Full Text: PDF>>
Buy this Article




Summary: 
We have studied an in situ edge preparation process and the effect of a substrate rotation during the edge preparation in order to improve the uniformity and electrical characteristics of high-Tc edge-type Josephson junctions. The improved YBa2Cu3Ox/PrBa2Cu3Ox/YBa2Cu3Ox edge junctions showed small 1σ-critical current spreads as low as 10% for 12 junctions. We have confirmed that the spreads do not increase significantly by adding groundplane over the junctions. In this paper, we will describe these processes developed for the fabrication of high-Tc superconducting integrated circuits.