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Fabrication Processes for High-Tc Superconducting Integrated Circuits Based on Edge-Type Josephson Junctions
Tetsuro SATOH Mutsuo HIDAKA Shuichi TAHARA
IEICE TRANSACTIONS on Electronics
Publication Date: 1998/10/25
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Issue on Low- and High-Temperature Superconductive Electron Devices and Their Applications)
Category: High-Tc Junction Technology
YBa2Cu3Ox, PrBa2Cu3Ox, Josephson junction, integrated circuit, groundplane,
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We have studied an in situ edge preparation process and the effect of a substrate rotation during the edge preparation in order to improve the uniformity and electrical characteristics of high-Tc edge-type Josephson junctions. The improved YBa2Cu3Ox/PrBa2Cu3Ox/YBa2Cu3Ox edge junctions showed small 1σ-critical current spreads as low as 10% for 12 junctions. We have confirmed that the spreads do not increase significantly by adding groundplane over the junctions. In this paper, we will describe these processes developed for the fabrication of high-Tc superconducting integrated circuits.