Advanced ATM Switching System Hardware Technologies Based on MCM-D for ATM Line Interface Circuits

Katsumi KAIZU

IEICE TRANSACTIONS on Communications   Vol.E81-B    No.2    pp.482-487
Publication Date: 1998/02/25
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on ATM Switching Systems for future B-ISDN)
Category: Advanced technologies for ATM system
ATM,  MCM,  assemble,  sub-module,  

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This paper describes advanced ATM switching system hardware that uses a high-performance and cost-effective MCM-D module as an ATM-layer function device. The MCM-D module is fabricated on a Si-substrate using the stacking RAM technique to reduce module size. The MCM has a 4-layer Si substrate, a high-performance ASIC, 8 high-speed SRAMs, and an FPGA. By using the stacking RAM technique, MCM-D module size is reduced to 50. 8 mm 50. 8 mm. This is 40% of that (100 mm 65 mm) of a double-side mounted sub-board module with conventional packaging (QFP and SOP). The MCM-D module realizes the ATM-layer functions that require a high-performance ASIC with a high-speed (access time 20 ns) and large-capacity (1 MBytes) SRAM cache. The MCM approach is quite effective in increasing memory access speed because it realizes high-density packaging. The MCM-D module is mounted on an ATM line interface circuit, and realizes 150 Mbit/s throughput ATM-layer functions (header conversion and on-line monitoring) in an ATM switching system. In addition, advanced ATM switching system hardware technologies with sub-module structure are also described. The MCM-D module is one of the sub-modules of the system. This MCM technology and sub-module technology can be applied to advanced ATM switching systems.