Isolator-Free DFB-LD Module with TEC Control Using Silicon Waferboard

Koji TERADA  Seimi SASAKI  Kazuhiro TANAKA  Tsuyoshi YAMAMOTO  Tadashi IKEUCHI  Kazunori MIURA  Mitsuhiro YANO  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E80-C   No.5   pp.703-706
Publication Date: 1997/05/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section LETTER (Special Issue on Photonic Integrated Circuits)
Category: Optoelectronic Packaging
Keyword: 
WDM,  optical access network,  isolator-free,  low power consumption,  TEC,  silicon waferboard,  

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Summary: 
This letter describes our DFB-LD module for use in WDM optical access networks. We realized an isolator-free DFB-LD module with a thermo-electric cooler in aim of stabilizing the emission wavelength for WDM systems. Silicon waferboard technology was employed to achieve simple assembly and small size of the module. This small size contributed to low TEC power. Our fabricated module demonstrated low-noise and stable emission wavelength characteristics under 156 Mbit/s pseudo random modulation.