Hillock-Free Aluminum-Based Alloy Interconnections for Active-Matrix Liquid-Crystal Displays

Kinya KATO  Tsutomu WADA  Nobuhiko KAKUDA  Tadamichi KAWADA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E80-C   No.2   pp.320-326
Publication Date: 1997/02/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: PAPER
Category: Electronic Displays
Keyword: 
aluminum-based alloy film,  liquid crystal display,  active-matrix,  

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Summary: 
A method is proposed for forming hillock-free aluminum-based alloy bus lines for active-matrix liquid-crystal displays (LCDs). Aluminum (Al)-based alloy films are deposited using an Al target containing boron (B) or nickel (Ni) in a sputtering ambient containing nitrogen. The Al-Ni films deposited using an Al target containing Ni showed excellent hillock resistance: virtually no hillock formation after thermal treatment at around 400 and no significant increase in resistivity. These films also showed good patternability with a simple wet etching: a smooth line edge and a gently tapered profile. These films are thus suitable for the bus lines of active matrices.