Low Cost Optical Module Packaging Techniques for Optical Access Network Systems

Kazuhiko KURATA  Kenji YAMAUCHI  Atsuhiro KAWATANI  Akio GOTO  Naoki KIMURA  Kimikazu HIGASHIKAWA  Satoshi DOHMAE  Hideki TANAKA  Shigeta ISHIKAWA  

IEICE TRANSACTIONS on Electronics   Vol.E80-C   No.1   pp.98-106
Publication Date: 1997/01/25
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Devices, Packaging Technology, and Subsystems for the Optical Access Network)
optical module,  packaging techniques,  passive alignment,  optical access network,  

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This paper describes packaging techniques based on a novel passive alignment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable for the automatic assembly line as well as the module mounting process on circuit board. In this paper, an advanced module applications such as a hybrid integrated wave guide module and a surface mountable (SMT) LD module is introduced.