Integration of a Power Supply for System-on-Chip

Satoshi MATSUMOTO  Masato MINO  Toshiaki YACHI  

IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences   Vol.E80-A   No.2   pp.276-282
Publication Date: 1997/02/25
Online ISSN: 
Print ISSN: 0916-8508
Type of Manuscript: INVITED PAPER (Special Section on Analog Circuit Techniques for System-on-Chip Integration)
power supply,  system on chip,  power IC,  SOI,  thin-film magnetic device,  

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Integrating the power supply and signal processing circuit into one chip is an important step towards achieving a system-on-chip. This paper reviews and looks at the current technologies and their trends for power supply components such as DC-DC converters, intelligent power LSIs, and thin-film magnetic devices for the system-on-chip. A device structure has been proposed for the system-on-chip that is based on a quasi-SOI technique, in which the buried oxide layer is partially removed from the SOI substrate. In this structure, the CMOS devices for the digital signal-processing circuit and the bipolar transistors are formed in a conventional SOI region, and the CMOS analog devices and high-voltage devices are formed in a quasi-SOI region.