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Integration of a Power Supply for System-on-Chip
Satoshi MATSUMOTO Masato MINO Toshiaki YACHI
IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1997/02/25
Print ISSN: 0916-8508
Type of Manuscript: INVITED PAPER (Special Section on Analog Circuit Techniques for System-on-Chip Integration)
power supply, system on chip, power IC, SOI, thin-film magnetic device,
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Integrating the power supply and signal processing circuit into one chip is an important step towards achieving a system-on-chip. This paper reviews and looks at the current technologies and their trends for power supply components such as DC-DC converters, intelligent power LSIs, and thin-film magnetic devices for the system-on-chip. A device structure has been proposed for the system-on-chip that is based on a quasi-SOI technique, in which the buried oxide layer is partially removed from the SOI substrate. In this structure, the CMOS devices for the digital signal-processing circuit and the bipolar transistors are formed in a conventional SOI region, and the CMOS analog devices and high-voltage devices are formed in a quasi-SOI region.