Yield Prediction Method Considering the Effect of Particles on Sub-Micron Patterning

Nobuyoshi HATTORI  Masahiko IKENO  Hitoshi NAGATA  

IEICE TRANSACTIONS on Electronics   Vol.E79-C   No.3   pp.277-281
Publication Date: 1996/03/25
Online ISSN: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Scientific ULSI Manufacturing Technology)
Category: CIM/CAM
yield prediction,  pattern defect,  photolithography,  semiconducter manufacturing,  

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A new yield prediction model has been developed, which can successfully describe the actual chip fabrication yield. It basically consists of modeling of particles deposited on wafer surface, considering the change in their size and spatial distribution due to the subsequent processing steps and a new concept of virtual line width in pattern layouts. It is confirmed that this yield prediction model serves as an effective navigator for improvement/optimization of fabrication lines such as pointing out the process step/equipments to be modified for yield improvements.