For Full-Text PDF, please login, if you are a member of IEICE,|
or go to Pay Per View on menu list, if you are a nonmember of IEICE.
Marker Alignment Method for Passive Laser Coupling on Silicon Waferboard
Seimi SASAKI Gohji NAKAGAWA Kazuhiro TANAKA Kazunori MIURA Mituhiro YANO
IEICE TRANSACTIONS on Communications
Publication Date: 1996/07/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section LETTER (Special Issue on Optical Access Networks toward Life Enhancement)
silicon platform, optical coupling, passive alignment, marker, laser diode,
Full Text: PDF(324.5KB)>>
We proposed a new marker design for passive alignment of a laser to a fiber on a silicon waferboard. Our fiducial marker is simple form and easy to fabricate. With a unique marker design, high accurate positioning of the laser chip is easily achieved using a conventional flip-chip bonder. We have successfully fabricated laser modules with uniform coupling, within 1 dB for a flat end single-mode fiber and within 2 dB for a hemispherical end fiber. This assembly method offers the potential for low-cost optical module packaging.