Marker Alignment Method for Passive Laser Coupling on Silicon Waferboard

Seimi SASAKI  Gohji NAKAGAWA  Kazuhiro TANAKA  Kazunori MIURA  Mituhiro YANO  

Publication
IEICE TRANSACTIONS on Communications   Vol.E79-B   No.7   pp.939-942
Publication Date: 1996/07/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section LETTER (Special Issue on Optical Access Networks toward Life Enhancement)
Category: 
Keyword: 
silicon platform,  optical coupling,  passive alignment,  marker,  laser diode,  

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Summary: 
We proposed a new marker design for passive alignment of a laser to a fiber on a silicon waferboard. Our fiducial marker is simple form and easy to fabricate. With a unique marker design, high accurate positioning of the laser chip is easily achieved using a conventional flip-chip bonder. We have successfully fabricated laser modules with uniform coupling, within 1 dB for a flat end single-mode fiber and within 2 dB for a hemispherical end fiber. This assembly method offers the potential for low-cost optical module packaging.