Summary: We proposed a new marker design for passive alignment of a laser to a fiber on a silicon waferboard. Our fiducial marker is simple form and easy to fabricate. With a unique marker design, high accurate positioning of the laser chip is easily achieved using a conventional flip-chip bonder. We have successfully fabricated laser modules with uniform coupling, within 1 dB for a flat end single-mode fiber and within 2 dB for a hemispherical end fiber. This assembly method offers the potential for low-cost optical module packaging.