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Three-Dimensional MMIC and Its Application: An Ultra-Wideband Miniature Balun
Ichihiko TOYODA Makoto HIRANO Tsuneo TOKUMITSU
IEICE TRANSACTIONS on Electronics
Publication Date: 1995/08/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology)
three-dimensional, MMIC, balun, multilayer, U-shaped micro-wire,
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A new three-dimensional MMIC structure and an ultra-wideband miniature MMIC balun are proposed. The MMIC is a combined structure of multilayer MMICs and U-shaped micro-wires. This technology effectively reduces chip size and enhances MMIC performance. The proposed balun is constructed with three narrow conductors located side by side. The U-shaped micro-wire technology is employed to reduce the insertion loss and chip size. 1.51 dB insertion loss over 10 to 30 GHz, and 2 dB and 5 degrees of amplitude and phase balances over 5 to 35 GHz have been obtained. The intrinsic area of the balun is only 450800 µm, about 1/5 to 1/3 the area of recently reported miniaturized MMIC baluns.