Suitable Conditions for Connections through the Plated Through Hole of Printed Circuit Boards

Hiroki OKA  Nobuaki SUGIURA  Kei-ichi YASUDA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E78-C    No.3    pp.304-310
Publication Date: 1995/03/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: PAPER
Category: Components
Keyword: 
plated through hole (PTH),  printed circuit board (PCB),  simulation analysis model,  signal reflection characteristics,  PTH diameter,  PTH pitch,  high-speed connectors,  

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Summary: 
B-ISDN telecommunication systems will require signal processing speeds up to 600 Mbps or more. We must therefore consider the affects of signal reflection, signal attenuation, time dalay, and so on when designing these systems. The higher the signal speed, the larger the electrical noise induced around the connector, especially in the plated through holes (PTHs) area. This paper presents the results of our investigation focused on connector mounting configurations in the signal transmission line, especially whether or not signals transmit through the PTH in a printed circuit board (PCB). How the signal reflection characteristics depend upon transmission line configurations are discussed and experimental results and simulation analyses for a transmission line system using a small miniature A-type (SMA) connector as an example are performed. It is suggested that designs for future high-speed signal transmission circuits take into account the PTH diameter and/or the PTH pitch conditions, values for which can be determined from simulation analysis.