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Examination of High-Speed, Low-Power-Consumption Thermal Head
IEICE TRANSACTIONS on Electronics
Publication Date: 1995/11/25
Print ISSN: 0916-8516
Type of Manuscript: PAPER
Category: Recording and Memory Technologies
high-speed, low-power-consumption, thermal head, heat insulation layer, heating resistor, thermal conductivity, heat characteristic, glass, polyimide,
Full Text: PDF>>
I have examined factors for implementing a high-speed, low-power-consumption thermal head. In conventional thermal heads, a heat insulation layer is provided between the heating resistor and the radiator. I found it desirable to implement fast operation and low power consumption to lower the thermal conductivity of the heat insulation layer and to thin the heat insulation layer. I also found there is an optimum heat characteristic to the thickness of one heat insulation layer. I assumed polyimide as a material for the heat insulation layer which could materialize the hypothesis, and studied necessary items based on the thermal calculation. I manufactured a trial thermal head on the basis of this result and confirmed that our assumptions were correct. In addition, to confirm that the assumption is also ultimately correct, I fabricated a trial thermal head only consisting of a heating resistor and without a protective coat and a heat insulation layer. I confirmed that the structure with only the heating resistor exhibited excellent heat response and consumed less power necessary for heating.