Examination of High-Speed, Low-Power-Consumption Thermal Head

Susumu SHIBATA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E78-C   No.11   pp.1632-1637
Publication Date: 1995/11/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: PAPER
Category: Recording and Memory Technologies
Keyword: 
high-speed,  low-power-consumption,  thermal head,  heat insulation layer,  heating resistor,  thermal conductivity,  heat characteristic,  glass,  polyimide,  

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Summary: 
I have examined factors for implementing a high-speed, low-power-consumption thermal head. In conventional thermal heads, a heat insulation layer is provided between the heating resistor and the radiator. I found it desirable to implement fast operation and low power consumption to lower the thermal conductivity of the heat insulation layer and to thin the heat insulation layer. I also found there is an optimum heat characteristic to the thickness of one heat insulation layer. I assumed polyimide as a material for the heat insulation layer which could materialize the hypothesis, and studied necessary items based on the thermal calculation. I manufactured a trial thermal head on the basis of this result and confirmed that our assumptions were correct. In addition, to confirm that the assumption is also ultimately correct, I fabricated a trial thermal head only consisting of a heating resistor and without a protective coat and a heat insulation layer. I confirmed that the structure with only the heating resistor exhibited excellent heat response and consumed less power necessary for heating.