A Bipolar-Based 0.5 µm BiCMOS Technology on Bonded SOI for High-Speed LSIs

Makoto YOSHIDA  Toshiro HIRAMOTO  Tsuyoshi FUJIWARA  Takashi HASHIMOTO  Tetsuya MURAYA  Shigeharu MURATA  Kunihiko WATANABE  Nobuo TAMBA  Takahide IKEDA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E77-C   No.8   pp.1395-1403
Publication Date: 1994/08/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on High Speed and High Density Multi Functional LSI Memories)
Category: General Technology
Keyword: 
BiCMOS,  bonded SOI,  double polysilicon bipolar,  trench isolation,  stress,  

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Summary: 
A new BiCMOS process based on a high-speed bipolar process with 0.5 µm emitter width has been developed using a bonded SOI substrate. Double polysilicon bipolar transistors with the trench isolation, shallow junctions and the pedestal collector implantation provide a high cut-off frequency of 27 GHz. Stress induced device degradation is carefully examined and a low stress trench isolation process is proposed.