For Full-Text PDF, please login, if you are a member of IEICE,|
or go to Pay Per View on menu list, if you are a nonmember of IEICE.
Deep Submicron Field Isolation with Buried Insulator between Polysilicon Electrodes (BIPS)
Masahiro SHIMIZU Masahide INUISHI Katsuhiro TSUKAMOTO Hideaki ARIMA Hirokazu MIYOSHI
IEICE TRANSACTIONS on Electronics
Publication Date: 1994/08/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Section on High Speed and High Density Multi Functional LSI Memories)
Category: General Technology
isolation, parasitic field transistor, MOSFET,
Full Text: PDF>>
A novel isolation structure which has a buried insulator between polysilicon electrodes (BIPS) has been developed. The BIPS isolation employs the refilling CVD-oxides in openings between polysilicon electrodes by photoresist etchback process. Device characteristics and parasitic effects of BIPS isolation have been compared with that of LOCOS isolation. Using BIPS isolation, we can almost suppress the narrow-channel effects and achieve the deep submicron isolation. No degradation on the subthreshold decay of devices with BIPS isolation can be obtained. The use of BIPS isolation technology yields a DRAM cell of small area. The successful fabrication of deep submicron devices with BIPS isolation clearly demonstrates that this technology has superior ability to overcome the LOCOS isolation.