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Coaxial SMD Module Connector for High-Speed MCM
Shinichi SASAKI Tohru KISHIMOTO Nobuaki SUGIURA
IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Connectors: Optical and Conventional
quasi-coaxial, surface mount technology, SMD, connector, multichip module,
Full Text: PDF(631.6KB)>>
This paper describes a trial coaxial surface mounted connector for PGA-type high-speed multichip modules (MCM). An MCM connector is needed to ensure testability and connection reliability of MCMs mounted on a printed circuit board. Our connector consists of a coaxial elements, a common ground housing made of conductive resin, and a ground contact spring plate. It has 68 signal contacts. We investigated the performance of this connector by experiment and simulation. Its insertion force is only about 53 gf per signal pin. The characteristic impedance is from 45.6 Ω to 61.4 Ω. The average resistance between two contacts is 28 mΩ with a deviation of less than plus or minus 5 mΩ. The insertion is -0.4 dB at 1.0 GHz. Crosstalk noise is less than 1.2%. This prototype connector can transmit pulses of up to 1.2 Gb/s, showing that it is applicable to high-speed MCMs.