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High-Density, High-Bandwidth Connectors for Broad-Band ISDN
Ken-ichi NAKANO Kei-ichi YASUDA Tohru KISHIMOTO
IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Connectors: Optical and Conventional
connector, coaxial, interconnection, packaging system, telecommunication system,
Full Text: PDF>>
High-speed pulse propagation, up to several hundred Mbps or higher, will play an important role in telecommunication systems for B-ISDN. High-performance packaging, especially high-speed, high-throughput interconnection, is strongly required. For advanced telecommunication systems, giga-bit signal transmission has been developed at the multi-chip module level, and 300 to 600 Mbps signal transmission has been reached at the printed circuit board level. Electrical inter-cabinet interconnections of 150 to 300 Mbps have been achieved for up to several tens of meters. High-speed, high-throughput connectors are the key to achieving high-performance telecommunication packaging systems. Two technologies are extremely important. One is for high-density, high-pin-count connectors, and the other is for high-speed signal transmission connectors. The requirements for the connectors needed for advanced high-performance telecommunication systems are described. Several high-density, high-bandwidth connectors developed for high-performance packaging system are introduced.